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0.2mmt Bk7 Glass Borofloat Wafer for Micro Sensor

0.2mmt Bk7 Glass Borofloat Wafer for Micro Sensor

$2.1 /piece price excl.VAT

Negotiable
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Minimal order
100 pieces

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Product Specifications

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Product Description

The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness ≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.

 

l Typical application:

Micro-optics

MEMS (pressure sensor, accelerometer...)

Wafer level packaging (image sensor package...)

Bioengineering (microfluidics, DNA analysis...)

PLC wafer cover

And many other customer-specific applications.

 

Technical parameter:

a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime 

b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)

c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)

d) Appearance: 60/40

e) Surface roughness (Ra) <1.5nm

f) Parallelism <0.01mm

g) Each edge is blunt C0.05~0.2mm

h) Crack <0.2mm, not crackable

i) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.

 

Technical parameters: 
Density(25ºC)2.2g/cm2 
Thermal expansion(ISO 7991)3.25´10-6k-1
Light transmittance91%
Softening point820ºC
Short time use<10h550ºC
Long time use>=10h450ºC
Refractive index
(587.6nm)
1.47140
Knoop hardness480

 

Coefficient of Linear Thermal Expansionα (20 - 300 °C)3.25 x 10-6 K-1(ISO 7991)Remarks
Specific Thermal
Capacity
Cp (20 - 100°C)0.83 KJ x (kg x K)-1The maximum temperatures in use indicated apply only if the following RTG and RTS values are observed at the same time.
 
Specific Thermal
Conductivity
λ (90°C)1.2 W x (m x K)-1
For short-term usageδ max (< 10 h)550°C
For long-term usageδmax (≥ 10 h)450°C

Viscosity of Borosilicate Glasses:

Working Point104 dPas1270 °C
Softening Point10 7.6 dPas820 °C
Annealing Point10 13 dPas560 °C
Strain Point10 14.5 dPas518 °C
Transformation Temperature (Tg) 525 °C

Selected Standard Lasers and Related Wavelengths:

Wavelength
(nm)
Laser
Medium
Wavelength
(nm)
Laser
Medium
Wavelength
(nm)
Laser
Medium
308XeCI488Ar1047Nd:YLF
325HeCd514.5Ar1053Nd:YLF
337N2532Nd:YAG1064Nd:YAG
350XeF632.8HeNe1153HeNe
351.1Ar694.3Ruby1319Nd:YAG
363.8Ar730-780Alexandrite1730Er:YLF
427N2850Er:YLF2060Ho:YLF
441.6HeCd905GaAs10640CO2

 

Wavelength λ(nm)435.8479.9546.1
Index of Refraction n1.480151.476761.47311
Wavelength λ(nm)589.3643.8656.3
Index of Refraction n1.471331.469531.46916
Abbe ConstantVe=(ne-1)/(nF'-nC')65.41 
Refractive Indexnd(λ587.6 nm)1.47140 
DispersionnF-nC71.4×10-4 
Stress-optical
Coefficentin in Mpa-1
K4.0×10-6mm2N-1MPa-1 

 

Supply Ability

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Packaging and Shipping

Lead time

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Port

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Packaging details

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