0.2mmt Bk7 Glass Borofloat Wafer for Micro Sensor
- Minimal order
- 100 pieces
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Product Specifications
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Product Description
The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness ≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.
l Typical application:
Micro-optics
MEMS (pressure sensor, accelerometer...)
Wafer level packaging (image sensor package...)
Bioengineering (microfluidics, DNA analysis...)
PLC wafer cover
And many other customer-specific applications.
Technical parameter:
a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime
b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance: 60/40
e) Surface roughness (Ra) <1.5nm
f) Parallelism <0.01mm
g) Each edge is blunt C0.05~0.2mm
h) Crack <0.2mm, not crackable
i) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.
| Technical parameters: | ||
| Density(25ºC) | 2.2g/cm2 | |
| Thermal expansion(ISO 7991) | 3.25´10-6k-1 | |
| Light transmittance | 91% | |
| Softening point | 820ºC | |
| Short time use<10h | 550ºC | |
| Long time use>=10h | 450ºC | |
| Refractive index (587.6nm) | 1.47140 | |
| Knoop hardness | 480 | |
| Coefficient of Linear Thermal Expansion | α (20 - 300 °C) | 3.25 x 10-6 K-1(ISO 7991) | Remarks |
| Specific Thermal Capacity | Cp (20 - 100°C) | 0.83 KJ x (kg x K)-1 | The maximum temperatures in use indicated apply only if the following RTG and RTS values are observed at the same time. |
| Specific Thermal Conductivity | λ (90°C) | 1.2 W x (m x K)-1 | |
| For short-term usage | δ max (< 10 h) | 550°C | |
| For long-term usage | δmax (≥ 10 h) | 450°C |
Viscosity of Borosilicate Glasses:
| Working Point | 104 dPas | 1270 °C |
| Softening Point | 10 7.6 dPas | 820 °C |
| Annealing Point | 10 13 dPas | 560 °C |
| Strain Point | 10 14.5 dPas | 518 °C |
| Transformation Temperature (Tg) | 525 °C |
Selected Standard Lasers and Related Wavelengths:
| Wavelength (nm) | Laser Medium | Wavelength (nm) | Laser Medium | Wavelength (nm) | Laser Medium |
| 308 | XeCI | 488 | Ar | 1047 | Nd:YLF |
| 325 | HeCd | 514.5 | Ar | 1053 | Nd:YLF |
| 337 | N2 | 532 | Nd:YAG | 1064 | Nd:YAG |
| 350 | XeF | 632.8 | HeNe | 1153 | HeNe |
| 351.1 | Ar | 694.3 | Ruby | 1319 | Nd:YAG |
| 363.8 | Ar | 730-780 | Alexandrite | 1730 | Er:YLF |
| 427 | N2 | 850 | Er:YLF | 2060 | Ho:YLF |
| 441.6 | HeCd | 905 | GaAs | 10640 | CO2 |
| Wavelength λ(nm) | 435.8 | 479.9 | 546.1 |
| Index of Refraction n | 1.48015 | 1.47676 | 1.47311 |
| Wavelength λ(nm) | 589.3 | 643.8 | 656.3 |
| Index of Refraction n | 1.47133 | 1.46953 | 1.46916 |
| Abbe Constant | Ve=(ne-1)/(nF'-nC') | 65.41 | |
| Refractive Index | nd(λ587.6 nm) | 1.47140 | |
| Dispersion | nF-nC | 71.4×10-4 | |
| Stress-optical Coefficentin in Mpa-1 | K | 4.0×10-6mm2N-1MPa-1 |
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