Product Specifications

Type

Poly

Product Description

Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .

Features:

1.High conversion efficiency resulting in superior power output performance.

2.Outstanding power output even in low light or high temperature conditions

3.Optimized design for ease of soldering and lamination

4.Long-term stability,reliability and performance

5.Output power tolerance of +/-3%

Physical characteristics:

                            Poly-Crystalline Silicon Solar Cell 4BB

Physical Characteristics

Dimension          156.75mm*156.75mm+0.5mm

Thickness            wafer(si):200um+30um

                                           180um+30um/-20um

Front(-)               Blue silicon nitride AR coating 1.0mm silver busbar 4BB. 

                            Full-surface aluminum back-surface field 2.0mm silver continuous or discrete                             soldering pads.

Data under standard testing conditions(STC):1000W/Sq.M, AM1.5, 25ºC

Electrical  characteristics

Products have  passed ISO14001, ISO9001, GB/T28000 and TUV, GB/T28000 ,TUV,CE and more than ten utility model patent certificates. 

Our advantage:

A.Quality and Safety

 1. Rigorous quality control meets the highest international standards.

2. High-transmissivity low-iron tempered glass, strong aluminium frame.

3. Using UV-resistant silicon.

4. IS09001/14001/CE/TUV/UL

B.Warranties

1. 10 years limited product warranty

2. 15 years at 90% of the minimal rated power output

3. 25 years at 80% of the minimal rated power output

Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight. 

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.

Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.

Supply Ability

--

Packaging and Shipping

Lead time

--

Port

--

Packaging details

--