Product Specifications

Type

Poly

Product Description

Flagsun's manufacturing covers the photovoltaic value chain from ingot casting and wafering through solar cell production and solar panel assembly.All the cell is with most strict quality standard in every production process .

Features:

1.High conversion efficiency resulting in superior power output performance.

2.Outstanding power output even in low light or high temperature conditions

3.Optimized design for ease of soldering and lamination

4.Long-term stability,reliability and performance

5.Output power tolerance of +/-3%

Physical characteristics:

Dimension:156*156mm±0.5mm

Thickness:Wafer(si):200μm±20μm

Cell:240μm±40μm

Front:Silver bus bars;Dark blue/others silicon nitride anti reflection coating

Back:Silver/aluminum bus bars;Full-surface aluminum BSF

* Data under standard testing conditions (STC): 1,000W/M, AM1.5, 25

* All figures bear ±3% of tolerance.

* The measurement of cell is calibrated by Fraunhofer ISE.

Typical temperature coefficients:

Voc.Temp.coef.%/K-0.333%/K 

Isc.Temp.coef.%/K +0.049%//K 

Pm.Temp.coef.%/K-0.42%/K

*Data under standard testing conditional (STC):1,000w/m2,AM1.5, 25°C , Pmax: Positive power tolerance.

Packaging & Shipping

1. Items are only shiped after PAYMENT is received.

2. Usually our solar cells are 100 pieces per box, 12boxes per carton.

3. Please check out your ADDRESS carefully when processing order.

4. Please CONTACT us ASAP if you haven't received the parcel.

5.Shipping will be via EMS, DHL, Fedex, UPS etc

Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight. 

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.

Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.

Supply Ability

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Packaging and Shipping

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