Shin Etsu high quality silicone heat dissipation Thermal conductivity1.09 W/mK in transistors thermistors heat sink greae G-747
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Product Description
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Place of Origin: Japan
Brand Name: Shin Etsu
Application: CPU Heat Sink Grease
Type: Greases
Specification: NSF
General Composition: Silicone Fluid Compound
Model Number: G-747
Appearance: White grease
Specific gravity: 2.65
Viscosity(Pa.s): 50
penetration(25℃/worked): 328
Oil separation(200℃/24h): 0.01*1
Thermical conductity(Watt/m℃): 0.90
Volume resistivity at 25C(ohm/cm: 2.5
Dielectric breakdown strength(KV) 0.25mm: 3.7
Volatile content(200℃/24H): 0.06*1
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Silicone greases start with a base oil of silicone fluid, to which are added various additives and fillers (metal soap, etc.). Silicone greases exhibit thermal oxidation stability over a wide temperature range, offer good moisture-resistance, and are used primarily for lubrication. Silicone oil compounds are products with a grease-like consistency. They are produced by blending materials such as silica powder into a base oil of silicone fluid. They exhibit thermal oxidation stability over a wide temperature range and have outstanding electrical properties and water repellency. Silicone oil compounds are used primarily in electrical insulators and seals, and for heat dissipation and water repellency.


Heat and cold resistance: Because the silicone fluid base oil has good resistance to heat and cold, the drop point is high, there is little oil separation, and volatile content is low.
Moisture resistance:These products have good resistance to water and moisture. Silicone greases can be left underwater for long periods; the surface will turn white, but there is almost no internal change. Safety:The silicone fluid base oil is chemically inactive, so these products pose almost no risk to humans and animals.
Efficiency:Excellent performance even when used in small amounts.






Thermal Interface Compounds (General Purpose) G-747:
All two feature silicone fluid as the base oil, plus thermally conductive fillers. These oil compounds offer excellent thermal conductivity and electrical properties.They are ideal for use as a thermal interface and insulator for semiconductor elements (transistors, thermistors) and various types of heatsinks.KS-609 is a general purpose product and G-747 can be used as a thermal interface material for resin-encapsulated power transistors.




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